Thermal padding GELID GP-Ultimate Thermal Pad 120x20x3 mm (TP-GP04-R-E)
The GP-Ultimate thermal pad is designed for installation on printed circuit boards with elements of various sizes and topologies, such as RAM and ROM chips, chipsets, analog chips, VRM power circuits, other integrated and Discrete surface mount components. Thanks to its high elasticity, GP-Ultimate covers electronic components, filling the gaps between them. And the gasket's increased thermal conductivity enables highly efficient heat transfer to one or more PCB-mounted heatsinks. Extended operating temperature range -60°C – 220°C also allows GP-Ultimate to be used in industrial electronics applications. The GP-Ultimate gasket is plate-shaped and is ideal for memory modules, VRM power circuits of motherboards and video cards, high-speed M.2 Type drives SSD and other dense surface mount electronic devices .
| В наявності | Так |
| Main characteristics | |
| Type of | Thermal padding |
| Manufacturer | GELID Solutions |
| Purpose | For memory |
| Weight of packing | 9 kg |
| Warranty | |
| Warranty | 12 months |
* Characteristics, delivery and appearance of the product may differ from those indicated and / or may be changed by the manufacturer without reflection of the product in the card.