Thermal padding GELID GP-Ultimate Thermal Pad 90x50x3 mm (TP-GP04-E)
The GP-Ultimate thermal pad is designed for installation on printed circuit boards with elements of various sizes and topologies, such as RAM and ROM chips, chipsets, analog chips, VRM power circuits, other integrated and discrete surface mount components. Due to its high elasticity, GP-Ultimate coats electronic components by filling in the gaps between them. And the gasket's increased thermal conductivity enables highly efficient heat transfer to one or more PCB-mounted heatsinks. Extended operating temperature range -60°C – 220°C also allows GP-Ultimate to be used in industrial electronics applications. The GP-Ultimate gasket is designed in the form of a plate and is optimally suited for memory modules, VRM power circuits of motherboards and video cards, high-speed M.2 Type SSD drives and other electronic devices with a dense surface mount .
Main characteristics | |
Type of | Thermal padding |
Manufacturer | GELID Solutions |
Purpose | For memory |
Warranty | |
Warranty | 12 months |
* Characteristics, delivery and appearance of the product may differ from those indicated and / or may be changed by the manufacturer without reflection of the product in the card.